Dragon-Star project is funded by FP7, aiming to support the Chinese participation in Horizon 2020, the reciprocity originating from the signed EU-China Scientific Cooperation Agreement, the bilateral cooperation in scientific, technological and industrial research and innovation fields, and the ongoing EU - China Innovation Cooperation Dialogue.

   

   
Newly Published Calls
   
   

New Technology Training Scheme

   
   

This scheme has been recently published by the Innovation and Technology Fund (ITF). The Training Scheme is administered by the Vocational Training Council (VTC). It aims to provide assistance to companies that would like to have their staffs trained in a new technology which would be useful to their businesses. New technologies include those which are not widely applied in Hong Kong, as well as those which will significantly benefit Hong Kong though their application.

   
    More info    
   
   
   
University-Industry Collaboration Programme (UICP)
   
   

The University-Industry Collaboration Programme (UICP) is funded by the Innovation and Technology Fund (ITF). It aims to stimulate private sector interest in R&D through leveraging the knowledge and resources of universities. The emphasis lies on collaboration between private companies and universities in Hong Kong. There are three schemes under this programme: Teaching Company Scheme, Matching Grant for Joint Research, and Industrial Research Chair Scheme.

   
    More info    
   
   
Getting Involved
   
    Generally speaking, the applicant will be required to fill in a standard application form designated by the national agency managing the programme, and submit it with the required documents to the secretariat of the national agency or a host organization of the funding programme.    
   
   
   
New Technology Training Scheme
   
   

To apply for the New Technology Training Scheme, applicants should complete and return the application form to the Vocational Training Council before the commencement of training with the copy of trainee's Hong Kong identity card. There is no specific deadline for submission of applications. www.proact.edu.hk/vtc/web/template/file.jsp?fldr_id=2708

   
   
   
   
University-Industry Collaboration Programme (UICP)
   
   

If the applicant is interested in UICP, please first identify a university partner and agree on the project details, the expected deliverables, the appropriate funding scheme for the project, etc. The applicant and the participating university can then fill out a UICP application form which can be obtained through www.itf.gov.hk/l-eng/Forms.asp. The registered personnel will be responsible for submitting the application proposal through the mentioned system. Applications can be submitted throughout the year. www.itf.gov.hk/l-eng/Forms.asp

   
   
   
    Forthcoming Events    
         
   

Grant Skills Training Workshop Health and Medical Research Fund (HMRF)
31 August 2013, Hong Kong, China

   
   

The aim of the workshop is to introduce the Health and Medical Research Fund and foster understanding of its scope, thematic priorities, grant application and review process. Clinical and academic staff with a strong interest in health-related research and those who just started their research careers are expected to be benefited most from the workshop.

   
    More info    
         
   

2013 the 2nd International Conference on Microelectronics, Optoelectronics and Nanoelectronics (ICMON 2013) 1st to 2nd September 2013, Beijing, China

   
   

ICMON is the main annual Microelectronics, Optoelectronics and Nanoelectronics conference that aims at presenting current research topics. The idea of ICMON 2013 is bring together scientists, scholars, engineers and students from universities all around the world and representatives from the industry to present ongoing research activities, and hence to foster research cooperation between universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face-to-face, to establish business or research cooperation and to identify global partners for future collaboration.

   
    More info    
         
   

2013 2nd International Conference on Engineering and Innovative Materials (ICEIM 2013)
7th to 8th September 2013, Shanghai, China

   
   

ICEIM is an annual International Conference on Engineering and Innovative Materials sponsored by IACSIT, and technically co-sponsored by many universities and institutes all around the world. 2013 2nd International Conference on Engineering and Innovative Materials (ICEIM 2013) will be held in Shanghai, China during September 7-8, 2013. The aim objective of ICEIM 2013 is to provide a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and activities in Engineering and Innovative Materials.

   
    More info    
         
   

The 3rd International Conference on Computer Science and Logistics Engineering (ICCSLE 2013)
13th to 15th September 2013, Hong Kong China

   
   

ICCSLE 2013 aims to provide an international forum for experts, engineers, academicians as well as industrial professionals all around the world who are engaged in computer science and logistics engineering to present their research projects and develop new ideas.

   
    More info    
   

 

For more information please contact us.